PCB Depanelizer – There Is Definitely More Than You Would Think In This Article..

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Micron Laser Technology presents PCB Depanelizer and part excising solutions for customer products, original equipment manufacturers, and pcb manufacturers. MLT’s numerous laser machining centers are geared up to handle volumes from prototyping to long production runs. Laser depaneling or part excising can cut through metals, plastics, dielectrics, or a combination of both.

Depending on the material and the part requirements, MLT provides a tool-less part removal process as final depaneling, hold-in tabs, scoring (v-grooves), and perforations. These laser processes have the advantage of speed, positional accuracy, no tooling cost or wear, no part induced stresses, and no cutting oils or some other contaminants.

Hold-in Tabs

Hold-in tabs are small uncut sections regarding the part used to secure the part in the panel. The hold-in tabs are used for easy of handling small parts or part securement for further processing. The hold-in tab width is chosen based on the amount of force desired to removed the part from the panel/sheet or known forces to get applied by downstream processes like component loading or electro-polish. MLT can produce tabs in most any material and to any width and site about the part.

Scoring

Laser scoring generates a limited depth ablation line in the part or material set. The depth is usually 50% from the material thickness but may be controlled to your desired depth. The scoring acts similar to the hold-tab to secure the part inside the panel or sheet, but enables individual parts to be ‘snapped’ out. Laser scoring lines can also be used being a deliberate path for stress relief or crack propagation. Prototypes utilize scoring lines in metal to accurately bend and form parts into shape without expensive forming dies.

Perforations

Similar to scoring or v-grooves, laser perforations are another option for tool-less part removal from the panel or sheet. Perforations can be laser formed to the size and spacing to satisfy the desired removal and Pneumatic PCB Depanelizer. Depending on the material and the part requirements, BEST laser services offers a tool-less part removal process in the form of final perforation, scoring and hold-in tabs. Using a laser to do the depaneling gives the user the advantage of speed and positional accuracy. Unlike mechanical methods there is no part induced stresses, no tooling cost with no cutting oils or some other contaminants.

Laser depaneling is perfect for rigid-flex boards as it provides a precise approach to cut through a variety of materials including however, not confined to the subsequent most frequent materials seen:

Combinations thereof, ideal for thicknesses of rigid flex laser depanelization, rigid flex depanelizedIn addition BEST could be that provider of laser depanelization when you have plenty of IoT devices which lmuteg to get precisely machined or eliminate to match perfectly in to small mechanical enclosures.

As a result of contact-free processing that goes on with laser depanelization of printed circuit boards, there is little distortion even when thin materials are utilized. When boards are milled or punched out using a mechanical tool there could end up being a loss precision and potentially a distortion within the outside board dimensions. Even worse it might crack solder joints when you use these mechanical means. In BEST laser depanelization system feature fiducial registration and internet based scaling, which suggests already existing distortions may be compensated and the cut contours positioned precisely within the layout.

The techniques for straight line Laser PCB Depaneling, which are create for rectangular-shaped PCBs, all cut or crush the edge of the board edge. These techniques include die cutting, punching or V-scoring the assembly or by using a wheel cutter or even a saw. The sawing method typically works with a single rotating blade spinning at high RPM to slice the panel in to the shapes required. This method produces heat within the reduce area as

well as creating debris as being a byproduct in the cutting operation. In V-scoring the depth of the thickness of the board is 30-40% of the original board thickness because it is cut from either side in the board. After assembly the board is broken around this v-score line. Alternately a “pizza cutter” cuts with the V-score from the panel and cuts the other web until the boards will be in their final cutout shape thereby putting strain on the components and solder joints-particularly those close to the board edge. In another method, the singulated board outline may be punched out form the panel. This calls for that the new punch be utilized for every kind of circuit board meaning it is far from a flexible method of board cut out. The punch force may also bend or deform the sides of the PCB.

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